Componentes

PCB for Three Phase Whole Current

PCB for Three Phase Whole Current

PCB name: MTI-3PFF-47X-5-20231226; PCB size (single module): 5.8x3.25inch; Layers: 2; Board Thickness: 1.6mm Green; Copper Foil Thickness: 35um; Material: FR‐4 KB6160, 1oz, Cu, (Finish)
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Introdução

Introdução

Product Details

PCB design information

PCB nameMTI-3PFF-47X-5-20231226
PCB size (single module)5.8x3.25inch
PCB panel size with extended PCBNIL
Layers2
Number of PCBs in ONE panel3
Required PCB quantity
Board Thickness1.6mm Green
Copper Foil Thickness35um
MaterialFR‐4 KB6160, 1oz, Cu, (Finish)
FinishingLead free HASL
Solder maskGreen
Solder Mask TypeKGS‐6188G
V-CUTyes
V-CUT Thickness
Electrical Test / E. testYes/Mark at board edge
BOW and Twist≤0.75%
Thermal Stress Test288°C/10 Sec
Via hole
P.T.H. Thickness20um
Silk Screen LayerWhite
Date code week/year Print on silk screen layer
Component Marking TypeM‐211(W)
Tin/Lead Thickness≥1um
Top and Bottom Registration+/‐ 3Mills
Solder test≥95% with plum tin plating
Hardness test6 H

Especificações

PCB name
MTI-3PFF-47X-5-20231226
PCB size (single module)
5.8x3.25inch
PCB panel size with extended PCB
NIL
Layers
2
Number of PCBs in ONE panel
3
Board Thickness
1.6mm Green
Copper Foil Thickness
35um
Material
FR‐4 KB6160, 1oz, Cu, (Finish)
Finishing
Lead free HASL
Solder mask
Green
Solder Mask Type
KGS‐6188G
V-CUT
yes
Electrical Test / E. test
Yes/Mark at board edge
BOW and Twist
≤0.75%
Thermal Stress Test
288°C/10 Sec
P.T.H. Thickness
20um
Silk Screen Layer
White
Component Marking Type
M‐211(W)
Tin/Lead Thickness
≥1um
Top and Bottom Registration
+/‐ 3Mills
Solder test
≥95% with plum tin plating
Hardness test
6 H

Fichas técnicas

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