Componentes
RD24-70 PCB design Specification
RD24-70 PCB design Specification
PCB name: MTI-1PSEM-94-1-20240118; PCB size (single module): 4.356x4.469inch; Layers: 2; Board Thickness: 1.6mm Green; Copper Foil Thickness: 35um; Material: FR‐4 KB6160, 1oz, Cu, (Finish)
Introducción
Introducción
Product Details
PCB design information
The Design of the PCB is a highly confidential asset that should NOT be shared with any other organization or manufacturer without written consent.
The technical problem regarding PCB manufacturing or any issue that needs further elaboration should be communicated to the R&D person that sent the Gerber files.
| PCB name | MTI-1PSEM-94-1-20240118 |
| PCB size (single module) | 4.356x4.469inch |
| PCB panel size with extended PCB | NIL |
| Layers | 2 |
| Number of PCBs in ONE panel | 4 |
| Required PCB quantity | |
| Board Thickness | 1.6mm Green |
| Copper Foil Thickness | 35um |
| Material | FR‐4 KB6160, 1oz, Cu, (Finish) |
| Finishing | Lead free HASL |
| Solder mask | Green |
| Solder Mask Type | KGS‐6188G |
| V-CUT | yes |
| V-CUT Thickness | |
| Electrical Test / E. test | Yes/Mark at board edge |
| BOW and Twist | ≤0.75% |
| Thermal Stress Test | 288°C/10 Sec |
| Via hole | |
| P.T.H. Thickness | 20um |
| Silk Screen Layer | White |
| Date code week/year Print on silk screen layer | |
| Component Marking Type | M‐211(W) |
| Tin/Lead Thickness | ≥1um |
| Top and Bottom Registration | +/‐ 3Mills |
| Solder test | ≥95% with plum tin plating |
| Hardness test | 6 H |
Especificaciones
- PCB name
- MTI-1PSEM-94-1-20240118
- PCB size (single module)
- 4.356x4.469inch
- PCB panel size with extended PCB
- NIL
- Layers
- 2
- Number of PCBs in ONE panel
- 4
- Board Thickness
- 1.6mm Green
- Copper Foil Thickness
- 35um
- Material
- FR‐4 KB6160, 1oz, Cu, (Finish)
- Finishing
- Lead free HASL
- Solder mask
- Green
- Solder Mask Type
- KGS‐6188G
- V-CUT
- yes
- Electrical Test / E. test
- Yes/Mark at board edge
- BOW and Twist
- ≤0.75%
- Thermal Stress Test
- 288°C/10 Sec
- P.T.H. Thickness
- 20um
- Silk Screen Layer
- White
- Component Marking Type
- M‐211(W)
- Tin/Lead Thickness
- ≥1um
- Top and Bottom Registration
- +/‐ 3Mills
- Solder test
- ≥95% with plum tin plating
- Hardness test
- 6 H