Description:
PCB name: MTI-1PSEM-94-1-20240118
PCB size (single module) :4.356x4.469inch
Layers:2
Board Thickness:1.6mm Green
Copper Foil Thickness:35um
Material: FR‐4 KB6160, 1oz, Cu, (Finish)
Product Brochure:DOWNLOAD
The Design of the PCB is a highly confidential asset that should NOT be shared with any other
organization or manufacturer without written consent. The design should NOT be shared with the other departments of Micro tech Industries under any circumstances. This includes price negotiations and conflict resolving email. The technical Problem regarding PCB manufacturing or any issue that needs further elaboration/discussion should be communicated to the R&D person that sent you the Gerber files. The issues regarding payments/shipping should be communicated to procurement department.
PCB design information | |
PCB name |
MTI-1PSEM-94-1-20240118 |
PCB size (single module) |
4.356x4.469inch |
PCB panel size with extended PCB |
NIL |
Layers |
2 |
Number of PCBs in ONE panel |
4 |
Required PCB quantity |
|
Board Thickness |
1.6mm Green |
Copper Foil Thickness |
35um |
Material |
FR‐4 KB6160, 1oz, Cu, (Finish) |
Finishing |
Lead free HASL |
Solder mask |
Green |
Solder Mask Type |
KGS‐6188G |
V-CUT |
yes |
V-CUT Thickness |
|
Electrical Test / E. test |
Yes/Mark at board edge |
BOW and Twist |
≤0.75% |
Thermal Stress Test |
288°C/10 Sec |
Via hole |
|
P.T.H. Thickness |
20um |
Silk Screen Layer |
White |
Date code week/year Print on silk screen layer | |
Component Marking Type |
M‐211(W) |
Tin/Lead Thickness |
≥1um |
Top and Bottom Registration |
+/‐ 3Mills |
Solder test |
≥95% with plum tin plating |
Hardness test |
6 H |
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