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rd24 70 pcb design specification-0

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RD24-70 PCB design Specification

Description

PCB nameMTI-1PSEM-94-1-20240118
PCB size (single module) 4.356x4.469inch
Layers2
Board Thickness1.6mm Green
Copper Foil Thickness35um
MaterialFR‐4 KB6160, 1oz, Cu, (Finish)

Appurtenance:

Product Brochure:DOWNLOAD

  • Introduction
Introduction

Product Details

The Design of the PCB is a highly confidential asset that should NOT be shared with any other

organization or manufacturer without written consent. The design should NOT be shared with the other departments of Micro tech Industries under any circumstances. This includes price negotiations and conflict resolving email. The technical Problem regarding PCB manufacturing or any issue that needs further elaboration/discussion should be communicated to the R&D person that sent you the Gerber files. The issues regarding payments/shipping should be communicated to procurement department.

PCB design information  
PCB name
MTI-1PSEM-94-1-20240118
PCB size (single module)
4.356x4.469inch
PCB panel size with extended PCB
NIL
Layers
2
Number of PCBs in ONE panel
4
Required PCB quantity
Board Thickness
1.6mm Green
Copper Foil Thickness
35um
Material
FR‐4 KB6160, 1oz, Cu, (Finish)
Finishing
Lead free HASL
Solder mask
Green
Solder Mask Type
KGS‐6188G
V-CUT
yes
V-CUT Thickness
Electrical Test / E. test
Yes/Mark at board edge
BOW and Twist
≤0.75%
Thermal Stress Test
288°C/10 Sec
Via hole
P.T.H. Thickness
20um
Silk Screen Layer
White
Date code week/year Print on silk screen layer
Component Marking Type
M‐211(W)
Tin/Lead Thickness
≥1um
Top and Bottom Registration
+/‐ 3Mills
Solder test
≥95% with plum tin plating
Hardness test
6 H

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