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Description：
PCB name MTI‐3PFF‐47X‐2‐230529
PCB size (single module) 5.5 x 4.25 inch (23.375sq‐inch)
PCB name MTI‐200‐1‐230111
PCB size (single module) 1.55 x 1.856 inch (2.8768sqinch)
PCB name MTI‐LTP‐3‐20230529
PCB size (single module) 4.2 x 3.2 inch (13.44sqinch)
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PCB size (single module) 5.5 x 4.25 inch (23.375sq‐inch)
PCB panel size with extended PCB NIL
Layers 2
Board Thickness 1.6mmGreen
Copper Foil Thickness 35um
Material FR‐4 KB6160, 1oz, Cu, (Finish)
Technical Parameters：
PCB design information | |
PCB name |
MTI‐3PFF‐47X‐2‐230529 |
PCB size (single module) |
5.5 x 4.25 inch (23.375sq‐inch) |
PCB panel size with extended PCB |
NIL |
Layers |
2 |
Number of PCBs in ONE panel |
2 |
Required PCB quantity |
|
Board Thickness |
1.6mm Green |
Copper Foil Thickness |
35um |
Material |
FR‐4 KB6160, 1oz, Cu, (Finish) |
Finishing |
Lead free HASL |
Solder mask (BOT) |
Green |
Solder Mask Type |
KGS‐6188G |
V-CUT |
yes |
V-CUT Thickness |
|
Electrical Test / E. test |
Yes/Mark at board edge |
BOW and Twist |
≤0.75% |
Thermal Stress Test |
288°C/10 Sec |
Via hole |
|
P.T.H. Thickness |
20um |
Silk Screen Layer |
White |
| Date code week/year Print on silk screen layer | |
Component Marking Type |
M‐211(W) |
Tin/Lead Thickness |
≥1um |
Top and Bottom Registration |
+/‐ 3Mills |
Solder test |
≥95% with plum tin plating |
Hardness test |
6 H |
PCB size (single module) 1.55 x 1.856 inch (2.8768sqinch)
PCB panel size with extended PCB NIL
Layers 2
Number of PCBs in ONE panel 12
Board Thickness 1.6mmGreen
Copper Foil Thickness 35um
Material FR‐4 KB6160, 1oz, Cu, (Finish)
Technical Parameters：
PCB design information | |
PCB name |
MTI‐200‐1‐230111 |
PCB size (single module) |
1.55 x 1.856 inch (2.8768sqinch) |
PCB panel size with extended PCB |
NIL |
Layers |
2 |
Number of PCBs in ONE panel |
12 |
Required PCB quantity |
|
Board Thickness |
1.6mm Green |
Copper Foil Thickness |
35um |
Material |
FR‐4 KB6160, 1oz, Cu, (Finish) |
Finishing |
Lead free HASL |
Solder mask (BOT) |
Green |
Solder Mask Type |
KGS‐6188G |
V-CUT |
yes |
V-CUT Thickness |
|
Electrical Test / E. test |
Yes/Mark at board edge |
BOW and Twist |
≤0.75% |
Thermal Stress Test |
288°C/10 Sec |
Via hole |
|
P.T.H. Thickness |
20um |
Silk Screen Layer |
White |
| Date code week/year Print on silk screen layer | |
Component Marking Type |
M‐211(W) |
Tin/Lead Thickness |
≥1um |
Top and Bottom Registration |
+/‐ 3Mills |
Solder test |
≥95% with plum tin plating |
Hardness test |
6 H |
PCB size (single module) 4.2 x 3.2 inch (13.44sqinch)
PCB panel size with extended PCB NIL
Layers 2
Number of PCBs in ONE panel 4
Board Thickness 1.6mmGreen
Copper Foil Thickness 35um
Material FR‐4 KB6160, 1oz, Cu, (Finish)
Technical Parameters：
PCB design information | |
PCB name |
MTI‐LTP‐3‐20230529 |
PCB size (single module) |
4.2 x 3.2 inch (13.44sqinch) |
PCB panel size with extended PCB |
NIL |
Layers |
2 |
Number of PCBs in ONE panel |
4 |
Required PCB quantity |
|
Board Thickness |
1.6mm Green |
Copper Foil Thickness |
35um |
Material |
FR‐4 KB6160, 1oz, Cu, (Finish) |
Finishing |
Lead free HASL |
Solder mask (BOT) |
Green |
Solder Mask Type |
KGS‐6188G |
V-CUT |
yes |
V-CUT Thickness |
|
Electrical Test / E. test |
Yes/Mark at board edge |
BOW and Twist |
≤0.75% |
Thermal Stress Test |
288°C/10 Sec |
Via hole |
|
P.T.H. Thickness |
20um |
Silk Screen Layer |
White |
| Date code week/year Print on silk screen layer | |
Component Marking Type |
M‐211(W) |
Tin/Lead Thickness |
≥1um |
Top and Bottom Registration |
+/‐ 3Mills |
Solder test |
≥95% with plum tin plating |
Hardness test |
6 H |
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